AWARD
35 -- Semiconductor Die Bonding and Vacuum Packaging System
- Notice Date
- 9/16/2026 1:32:29 AM
- Notice Type
- Award Notice
- NAICS
- 333993
— Packaging Machinery Manufacturing
- Contracting Office
- NAVAL RESEARCH LABORATORY WASHINGTON DC 20375-5328 USA
- ZIP Code
- 20375-5328
- Solicitation Number
- N0017326P2436
- Archive Date
- 09/29/2026
- Point of Contact
- KEVIN NGUYEN
- E-Mail Address
-
kevin.nguyen3.civ@us.navy.mil
(kevin.nguyen3.civ@us.navy.mil)
- Award Number
- N0017326P2436
- Award Date
- 09/14/2026
- Awardee
- COOK AND WEIL, INC. Morganville NJ 07751 USA
- Award Amount
- 672985.00
- Description
- This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.
- Web Link
-
SAM.gov Permalink
(https://sam.gov/workspace/contract/opp/68c5094fd20d471388d9a1346950e9f7/view)
- Place of Performance
- Address: Washington, DC 20375, USA
- Zip Code: 20375
- Country: USA
- Zip Code: 20375
- Record
- SN07972430-F 20260918/260916230038 (samdaily.us)
- Source
-
SAM.gov Link to This Notice
(may not be valid after Archive Date)
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